Synthesis of fluorine-containing analogues of N-aminoglutethimideSAMPSON, P; HAMMOND, G. B; PLECEY, R. G et al.Journal of the Chemical Society. Perkin transactions. I. 1989, Num 1, pp 175-178, issn 0300-922X, 4 p.Article

Synthesis of the aromatase inhibitor 3-ethyl-3-(4-pyridyl)piperidine-2,6-dione and its enantiomersMCCAGUE, R; JARMAN, M; ROWLANDS, M. G et al.Journal of the Chemical Society. Perkin transactions. I. 1989, Num 1, pp 196-198, issn 0300-922X, 3 p.Article

A photosensitive polymide using an alkaline aqueous solution as a developerNISHIZAWA, H; SATO, K; KOJIMA, M et al.Polymer engineering and science. 1992, Vol 32, Num 21, pp 1610-1612, issn 0032-3888Conference Paper

Novel auto-photosensitive polyimides with tailored propertiesROHDE, O; SMOLKA, P; FALCIGNO, P. A et al.Polymer engineering and science. 1992, Vol 32, Num 21, pp 1623-1629, issn 0032-3888Conference Paper

The origin of β relaxations in segmented rigid-rod polyimide and copolyimide filmsARNOLD, F. E; BRUNO, K. R; DEXING SHEN et al.Polymer engineering and science. 1993, Vol 33, Num 21, pp 1373-1380, issn 0032-3888Article

Pre-tilt angles as a function of polyimide composition for copolyimidesYOKOKURA, H; MYRVOLD, B. O; KONDO, K et al.Journal of material chemistry. 1994, Vol 4, Num 11, pp 1667-1671, issn 0959-9428Article

Acridine derivatives. III: Preparation and antitumor activity of the novel acridinyl-substituted uracilsKIMURA, M; OKABAYASHI, I; KATO, A et al.Chemical and pharmaceutical bulletin. 1989, Vol 37, Num 3, pp 697-701, issn 0009-2363, 5 p.Article

A new positive-type photoreactive polyimide precursor using 1,4-dihydropyridine derivativeOMOTE, T; YAMAOKA, T.Polymer engineering and science. 1992, Vol 32, Num 21, pp 1634-1641, issn 0032-3888Conference Paper

Adhesive bonding study of amorphous LARC-TPIPROGAR, D. J; ST. CLAIR, T. L.Journal of adhesion science and technology. 1994, Vol 8, Num 1, pp 67-83, issn 0169-4243Article

Evaluation of a thermoplastic polyimide (422) for bonding GR/PI compositePROGAR, D. J.Journal of adhesion science and technology. 1988, Vol 2, Num 6, pp 449-461, issn 0169-4243Article

Synthesis of novel silicon-modified polymidesBIAŁECKA-FLORJANCZYK, Ewa; ORZESZKO, Andrzej.Polymer bulletin (Berlin. Print). 2002, Vol 48, Num 6, pp 431-438, issn 0170-0839, 8 p.Article

Advanced polyimide materials: Syntheses, physical properties and applicationsLIAW, Der-Jang; WANG, Kung-Li; HUANG, Ying-Chi et al.Progress in polymer science. 2012, Vol 37, Num 7, pp 907-974, issn 0079-6700, 68 p.Article

Adhesive evaluation of bisimide additives in LARC-TPIPROGAR, D. J; ST. CLAIR, T. L.Journal of adhesion science and technology. 1991, Vol 5, Num 9, pp 711-726, issn 0169-4243Article

Process characterization of an aqueous developable photosensitive polyimide on a broadband stepperFLACK, Warren W; KULAS, Scott; FRANKLIN, Craig et al.SPIE proceedings series. 2000, pp 452-463, isbn 0-8194-3617-8Conference Paper

Progress in polyimide chemistry IKRICHELDORF, Hans R.Advances in polymer science. 1999, Vol 140, issn 0065-3195, 185 p.Serial Issue

Stable second-order nonlinear optical polymer network based on an organosoluble polyimideHSIUE, G. H; KUO, J. K; JENG, R. J et al.Chemistry of materials. 1994, Vol 6, Num 7, pp 884-887, issn 0897-4756Article

Polyimide ablation using intense laser beamsSOBEHART, J. R.Journal of applied physics. 1993, Vol 74, Num 4, pp 2830-2833, issn 0021-8979Article

Intrinsically photosensitive polyimides : approaches to fluorinated homologsMOORE, J. A; GAMBLE, D. R.Polymer engineering and science. 1992, Vol 32, Num 21, pp 1642-1645, issn 0032-3888Conference Paper

Carbonization and graphitization of polymide film NovaxINAGAKI, M; LI-JUN MENG; IBUKI, T et al.Carbon (New York, NY). 1991, Vol 29, Num 8, pp 1239-1243, issn 0008-6223Article

Curing of polyimidesFEGER, C.Polymer engineering and science. 1989, Vol 29, Num 5, pp 347-351, issn 0032-3888Article

Progress in polyimide chemistry. IIKRICHELDORF, H. R.Advances in polymer science. 1999, Vol 141, issn 0065-3195, 251 p.Serial Issue

Effect of cold-drawing on the carbonization of polyimide filmsTAKEICHI, T; TAKENOSHITA, H; OGURA, S et al.Chemistry Letters. 1993, Num 4, pp 657-658, issn 0366-7022Article

Comparison of finite element stress analysis results with peel strength at the copper-polyimide interfaceLACOMBE, R. H; BUCHWALTER, L. P; HOLLOWAY, K et al.Journal of adhesion science and technology. 1993, Vol 7, Num 12, pp 1293-1307, issn 0169-4243Article

The use of peel tests to examine the self adhesion of polyimide filmsBROWN, H. R; YANG, A. C. M.Journal of adhesion science and technology. 1992, Vol 6, Num 3, pp 333-346, issn 0169-4243Article

Structuring of polyimide by ArF excimer laser ablationSPIESS, W; STRACK, H.Semiconductor science and technology. 1989, Vol 4, Num 6, pp 486-490, issn 0268-1242, 5 p.Article